“Our aim was to design an extremely innovative transceiver that meets the critical requirements for widespread adoption of femtocell technology. Jazz’s SiGe BiCMOS technology and expertise in modeling enabled us to integrate high levels of functionality into our leading-edge product,” said Ebrahim Bushehri, CEO of Lime Microsystems. “We are excited to introduce this advanced wireless multi-band, multi-standard RF transceiver IC to customers at Mobile World Congress 2009.”

“Jazz is delighted to participate with a technology leader such as Lime Microsystems in this new market opportunity that leverages our high performance, 150GHz, 0.18-micron SiGe technology (SBC18). While SBC18 is a mature platform in use for cell phone transceivers, optical data networks and TV tuners amongst other applications, it continues to be the technology of choice for innovative products that require advanced analog and RF performance while remaining in a cost-effective technology node,” said Dr. Marco Racanelli, Senior Vice President and General Manager of RF and High-Performance Analog at Jazz Semiconductor.

About Lime Microsystems
Founded in March 2005, Lime Microsystems is a fabless semiconductor company specializing in digitally configurable transceivers for the next generation of wireless broadband systems. Lime has developed broadband transceiver ICs that significantly reduce the bill of materials for small cell (femtocell and picocell) wireless networks. Working in partnership with leading baseband technology companies, the company has also produced a reference design in industry-standard MicroTCA format. Lime has development teams in the UK and Lithuania and is backed by ACT Venture Capital and DFJ Esprit. Further information is available at www.limemicro.com.

About Jazz Semiconductor, Inc.
Jazz Semiconductor, Inc., a Tower Group Company (NASDAQ: TSEM, TASE: TSEM), is a leading wafer foundry focused on Analog-Intensive Mixed-Signal (AIMS) process technologies. Jazz offers world-class design enablement tools to allow complex designs to be achieved quickly and more accurately. The company’s comprehensive process portfolio of modular AIMS technologies includes RFCMOS, Analog CMOS, Silicon and SiGe BiCMOS, SiGe C-BiCMOS, Power CMOS and High Voltage CMOS. Through access to Tower’s process technologies, Jazz offers Digital CMOS, Embedded NVM, CMOS Image Sensors, and Flash MTP and OTP solutions. Jazz Semiconductor’s executive offices and its U.S. wafer fabrication facility are located in Newport Beach, CA. Additional capacity is available through access to Tower’s two manufacturing facilities in Israel. Jazz also has manufacturing capacity in China through partnerships with ASMC and HHNEC. For more information, please visit and www.jazzsemi.com and www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties.  Actual results may vary from those projected or implied by such forward-looking statements.  A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s and Jazz’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority and Jazz’s most recent filings on Forms 10-K and 10-Q, as were filed with the SEC. Tower and Jazz do not intend to update, and expressly disclaim any obligation to update, the information contained in this release.