Hybrid bonding capability strongly complements SkyWater’s developing portfolio of heterogeneous integration solutions including silicon interposer and fan-out packaging

SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Adeia, the newly launched brand for the IP licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”), today announced that SkyWater signed a technology licensing agreement with Xperi Corporation. SkyWater and its customers will now have access to Adeia’s ZiBond^® direct bonding and DBI^® hybrid bonding technology and IP to enhance next generation devices for commercial and government applications. This technology adds to SkyWater’s developing heterogeneous integration platform solutions in its Florida facility which also includes silicon interposer and fan-out wafer-level packaging (FOWLP) technologies.

“It’s an exciting time in the semiconductor industry, where advanced packaging technology has become a key enabler for product performance and innovation. Adeia has pioneered 3D integration with hybrid bonding and is leading industry adoption through technology knowhow transfer,” said Laura Mirkarimi, vice president, 3D semiconductor portfolio and technology of Adeia. “We applaud SkyWater’s efforts to offer this technology to their customers.”

“We’re pleased to offer our customers access to Adeia’s hybrid bonding technology as the industry continues to shift toward advanced 3D technologies and architectures to scale performance and functionality,” said Dr. Steven Kosier, SkyWater’s chief technology officer. “We see demand from our customers for domestic advanced packaging capabilities which provide supply chain transparency and robust IP protection. We’re investing in this technology today with Adeia, a recognized leader in hybrid bonding, because it enables our customers’ product roadmaps, competitive advantage, and accelerated time to market.”

As traditional Moore’s Law scaling shows diminishing returns and becomes more expensive, the industry is progressively looking toward 2.5D and 3D stacking and integration technologies to meet market demands. The 3D high performance packaging market is expected to grow to nearly $8B by 2027¹. Hybrid bonding 3D integration technology is increasingly being utilized in various semiconductor devices such as sensors, memory, and logic to enable increased I/O density, improved electrical and mechanical performance, and reduced size and cost. Hybrid bonding will enable a new wave of semiconductor devices rearchitected with 3D in mind from the start as opposed to simply stacking conventional 2D-architected designs.

About Adeia

Adeia invents, develops and licenses fundamental innovations that shape the way millions of people explore and experience entertainment in an increasingly connected world. From TVs to smartphones, and across all types of entertainment experiences, Adeia’s technologies allow users to manage content and connections in a way that is smart, immersive and personal. For more information, please visit adeia.com.

About Xperi Holding Corporation

Xperi invents, develops, and delivers technologies that enable extraordinary experiences. Xperi technologies, delivered via its brands (Adeia, DTS, HD Radio, IMAX Enhanced, TiVo), and by its startup, Perceive, make entertainment more entertaining, and smart devices smarter. Xperi technologies are integrated into billions of consumer devices, media platforms, and semiconductors worldwide, driving increased value for partners, customers and consumers.

Xperi, Adeia, DTS, IMAX Enhanced, HD Radio, Perceive, TiVo and their respective logos are trademarks or registered trademarks of affiliated companies of Xperi Holding Corporation in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

Xperi Safe Harbor Statement

This press release contains “forward-looking statements” within the meaning of the federal securities laws, including Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. These forward-looking statements are based on Xperi’s current expectations, estimates and projections about industry and market trends and expected growth. In this context, forward-looking statements often address expected future business, financial performance and financial condition, and often contain words such as “expect,” “anticipate,” “intend,” “plan,” “believe,” “could,” “seek,” “see,” “will,” “may,” “would,” “might,” “potentially,” “estimate,” “continue,” “expect,” “target,” similar expressions or the negatives of these words or other comparable terminology that convey uncertainty of future events or outcomes. All forward-looking statements by their nature address matters that involve risks and uncertainties, many of which are beyond our control, and are not guarantees of future results, such as statements about the anticipated benefits of the transaction. These and other forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause actual results to differ materially from those expressed in any forward-looking statements. Accordingly, there are or will be important factors that could cause actual results to differ materially from those indicated in such statements and, therefore, you should not place undue reliance on any such statements and caution must be exercised in relying on forward-looking statements. Important risk factors that may cause such a difference include, but are not limited to: anticipated tax treatment, unforeseen liabilities, future capital expenditures, revenue, cost savings, expenses, earnings, synergies, economic performance, indebtedness, financial condition, losses, future prospects, business strategies, and expansion and growth of Xperi’s businesses; Xperi’s ability to implement its business strategy; pricing trends, including Xperi’s ability to achieve economies of scale; the ability of Xperi to retain and hire key personnel; uncertainty as to the long-term value of Xperi’s common stock; legislative, regulatory and economic developments affecting Xperi’s business; general economic and market developments and conditions; failure to remediate the material weaknesses in our internal control over financial reporting; the evolving legal, regulatory and tax regimes under which Xperi operates; unpredictability and severity of catastrophic events, including, but not limited to, acts of terrorism or outbreak of war or hostilities, including Russia’s invasion of Ukraine, and natural disasters; the extent to which the COVID-19 pandemic continues to have an adverse impact on our business, results of operations, and financial condition will depend on future developments, including measures taken in response to the pandemic, which are highly uncertain and cannot be predicted; the impact of semiconductor supply chain constraints on our customers; and any plans regarding the separation of Xperi’s IP and Product businesses. These risks, as well as other risks associated with the business, are more fully discussed in Xperi’s filings with the U.S. Securities and Exchange Commission (“SEC”), including Xperi’s Annual Report on Form 10-K. While the list of factors presented here is, and the list of factors presented in Xperi’s filings with the SEC are, considered representative, no such list should be considered to be a complete statement of all potential risks and uncertainties. Unlisted factors may present significant additional obstacles to the realization of forward-looking statements. Consequences of material differences in results as compared with those anticipated in the forward looking statements could include, among other things, business disruption, operational problems, financial loss, legal liability to third parties and similar risks, any of which could have a material adverse effect on Xperi’s consolidated financial condition, results of operations, liquidity or trading price of common stock. Xperi does not assume any obligation to publicly provide revisions or updates to any forward-looking statements, whether as a result of new information, future developments or otherwise, should circumstances change, except as otherwise required by securities and other applicable laws.

About SkyWater Technology

SkyWater (NASDAQ: SKYT) is a U.S.-owned semiconductor manufacturer and a DOD-accredited Trusted supplier. SkyWater’s Technology as a Service^SM model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, ROICs, rad-hard ICs, power discretes, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and IoT. For more information, visit: www.skywatertechnology.com.

SkyWater Technology Forward-Looking Statements

This press release contains “forward-looking” statements within the meaning of the Private Securities Litigation Reform Act of 1995, including statements that are based on the Company’s current expectations or forecasts of future events, rather than past events and outcomes, and such statements are not guarantees of future performance. Forward-looking statements are subject to risks, uncertainties and assumptions, which may cause the Company’s actual results, performance or achievements to be materially different from those expressed or implied by such forward-looking statements. Key factors that could cause the Company’s actual results to be different than expected or anticipated include, but are not limited to, factors discussed in the “Risk Factors” section of its annual report on Form 10-K and quarterly reports on Form 10-Q, and in other documents that the Company files with the SEC, which are available at http://www.sec.gov. The Company assumes no obligation to update any forward-looking statements, which speak only as of the date of this press release.

SKYT-CORP

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¹ https://www.i-micronews.com/products/high-end-performance-packaging-2022-focus-on-2-5d-3d-integration/?utm_source=PR&utm_medium=email&utm_campaign=PR_HIGH_END_PERFORMANCE_PACKAGING_Relaunch_YOLE_March2021

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